Expanded Product List
Master Bond Product Search
357 products match
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EP65HT-1 Two part, fast setting (3-5 minutes in 10-20 gram masses) room temperature curing epoxy. Serviceable from -60°F to +400°F. Tg of 125-130C. NASA low outgassing approved. Used by Boeing in various MRO applications. High tensile modulus. Excellent dimensional stability. Withstands 1,000 hours 85°C/85%RH. Can be applied with gun dispenser. |
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EP70CN Two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. Features robust electrical insulation combined with lower exotherm enabling it to be used in a wide array of potting applications. Service temperature range is -80°F to +450°F. |
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EP72M4 Tough, resilient, room temperature curing epoxy adhesive. Resists exposure to vibration, impact and shock. Superior peel and shear strength. |
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EP75-1 Non-magnetic graphite conductive epoxy system. Useful lubricity. Exceptional dimensional stability. High bond strength properties. Superior durability. Volume resistivity 50-100 ohm-cm. Used in EMI/RFI shielding and static dissipation applications. Cost effective. Serviceable from -60°F to +250°F. |
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EP76M Nickel filled electrically conductive epoxy adhesive. Volume resistivity 5-10 ohm-cm. Cures at ambient temperatures. Convenient one to one mix ratio weight or volume. Serviceable from -60°F to +250°F. High compressive strength. Low shrinkage. Useful for applications requiring shielding and static dissipation. |
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EP76M-F Fast setting nickel filled electrically conductive epoxy adhesive. Room temperature curing. Volume resistivity 5-10 ohm-cm. Serviceable from -60°F to +250°F. Convenient one to one mix ratio weight or volume. Paste consistency. Good resistance to chemicals. High bond strength. |
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EP76MHT Two component nickel filled electrically conductive epoxy adhesive. Volume resistivity of 5-10 ohm-cm. Serviceable from -60°F to +400°F. Forgiving one to one mix ratio by weight or volume. High bond strength. Thermal conductivity. Paste like consistency. Superb dimensional stability. Applications include EMI/RFI shielding and static dissipation. |
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EP77M-1 Silver filled electrically conductive epoxy adhesive. Smooth paste viscosity. Volume resistivit <10-3 ohm-cm. Good rigidity. Formulated to cure at room temperature. Serviceable from -60°F to +300°F. Superb thermal conductivity. Dimensional stability. Available in premixed and frozen syringes. |
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EP77M-F Rapid room temperature curing silver filled electrically conductive adhesive. One to one mix ratio by weight or volume. Fixture time within 5-7 minutes even in small volumes. Exceptional low volume resistivity. Low outgassing. Superior bond strength to similar/dissimilar substrates/ Serviceable from -60°F to +250°F. |
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EP77M-FMed Rapid room temperature curing silver filled electrically conductive adhesive. One to one mix ratio by weight or volume. Fixture time within 5-7 minutes even in small volumes. Exceptional low volume resistivity. Low outgassing. Superior bond strength to similar/dissimilar substrates. Serviceable from -60°F to +250°F. |