Expanded Product List
Master Bond Product Search
71 products match
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Supreme 10HTFL Highly flexible, no mix adhesive. Offers outstanding peel strength. 100% reactive. Superior water and chemical resistance. Successfully tested for 1,000 hours 85°C/85% RH. Withstands rigorous thermal cycling. Serviceable from 4k to +350°F. |
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Supreme 10HTLV One part structural epoxy with high bond strength and excellent adhesion to similar and dissimilar substrates, especially composite materials. Requires oven curing at 250-300°F. NASA low outgassing approved. Serviceable from 4k to +400°F. Tough and durable. 85°C/85% RH resistance. |
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Supreme 10HTN-NV High peel and shear strength single component nickel filled epoxy adhesive. Thixotropic system. Cost effective electrical conductivity. Resists from 4k to +400°F. |
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Supreme 10HTND-3 Toughened, non-drip epoxy adhesive featuring high peel and shear strength properties. 100% reactive. Serviceable from 4k to +400°F. No viscosity change over time. Heat curable. |
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Supreme 10HTS Silver filled system with excellent electrical conductivity and high physical strength properties. One part, heat cured (250-300°F) epoxy. Wide range of serviceability from cryogenic temperatures up to +400°F. Meets NASA low outgassing specifications. Can be applied without sagging or dripping, even on vertical surfaces. Volume resistivit <0.006 ohm-cm. Thermally conductive. Shore D hardnes >75. |
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Supreme 12AOHT-LO One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |
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Supreme 33ND Toughened, two component, non-drip epoxy adhesive, sealant, coating. Gap filling. Temperature range from -80°F to +425°F. Thermal shock and chemical resistant. Excellent durability and dimensional stability. Minimal shrinkage upon curing. Solid electrical insulator. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 42HT-2 High temperature resistant epoxy adhesive. Toughened. Excellent bond strength. Withstands exposure to many acids, bases, solvents, fuels and oils. Easy application. Service temperature range -80°F to +450°F. Good flow properties. Low exotherm. Long working life. Reliable electrical insulator. Resists thermal cycling. |
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Supreme 42HT-2ND Non-drip epoxy paste has outstanding temperature and chemical resistance. Superior toughness and thermal cycling capability. Meets low outgassing specifications. Withstands 1,000 hours 85°C/85% RH. Superb electrical insulator. Service temperature range -80°F to +450°F. |